conductive plastic masterbatch for all kinds of conductive/EMI
shielding
Product Name: Conductive Plastic Agglomerates
Description:PC-ABS SUPER TOUGH AND ELEVATED TEMPERATURE GRADES (ST)
Provides up to high temperature 105° C continuous use temperature
rating and the lowest possible surface resistivity for excellent
grounding properties. Filled with nickel-plated carbon fiber
exclusively to maximize conductive properties of the molded
product.
Purpose: Antistatic turnover box, IC and LCD pallet, IC encapsulation,
wafer carrier, film bag for production process of precise
electronic component such as integrated circuit, wafer and
transducer; housing and structural parts of anti-explosion
products; semi-conductive shielding compound used in middle and
high voltage cable; EMI shielding housing of electric appliance in
fields of telecommunication, computer, automatic system, electronic
products for industry, consumption and automobile.
Range Of Application: Plastic products such as PVC, PP, PA, PC, TPU, PE and ABS are
available. It is easy to color and recyclable.
ENGINEERING AND PRODUCT SUPPORT
Our experienced engineers are available to help with optimal
material selection and manufacturing strategies for each project.
This includes support to ensure properly matched EMI gaskets,
product design strategies, tooling, and other needs.
Technical Parameter:
| Fiber Diameter(m) | 12 |
| Fiber Filaments (f) | 5000~10000 |
| Agglomerate length(mm) | 1～10 (its length should be consistent for same specification) |
| Agglomerate Diameter (mm) | 2 |
| Agglomerate External Appearance | the surface is smooth |
Packing:
No Packaging Size Limitations
Dry blends (that use multiple pellet mixtures) have packaging
limitations – they are sold only in smaller bags or containers, and
carry the risk of the heavier pellets settling during
transportation.
When settling occurs, it results in inconsistency in shielding and
mechanical performance. Large volume programs can save significant
labor hours by using single pellet products such as PREMIER.
